Heat-resistant overwrap film

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 23/20 (2006.01) C08J 5/18 (2006.01)

Patent

CA 2096581

The improved heat-resistant overwrap film is formed from a resin composition that comprises (A) 98 - 70 parts by weight of a 4-methyl-1-pentane based polymer, (B) 1 - 15 parts by weight of a butane based liquid polymer having a kinematic viscosity of 2 - 5000 cSt at 100°C, and (C) 1 - 15 parts by weight of a butane-1 based solid polymer, with the sum of (A) + (B) + (C) being 100 parts by weight. The film is excellent in heat resistance, flexibility, tackiness and transparency.

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