C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/20 (2006.01) C08J 5/18 (2006.01)
Patent
CA 2096581
The improved heat-resistant overwrap film is formed from a resin composition that comprises (A) 98 - 70 parts by weight of a 4-methyl-1-pentane based polymer, (B) 1 - 15 parts by weight of a butane based liquid polymer having a kinematic viscosity of 2 - 5000 cSt at 100°C, and (C) 1 - 15 parts by weight of a butane-1 based solid polymer, with the sum of (A) + (B) + (C) being 100 parts by weight. The film is excellent in heat resistance, flexibility, tackiness and transparency.
Imuta Shinichi
Kato Tatsuo
Kobayashi Masami
Nagase Yasushi
Mitsui Chemicals Inc.
Mitsui Petrochemical Industries Ltd.
Smart & Biggar
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