Heat resistant resin composition

Details Heat resistant resin composition Heat resistant resin composition

C - Chemistry, Metallurgy

08

G

402/219, 400/580

C08G 59/40 (2006.01)

Patent

CA 1118941

ABSTRACT OF THE DISCLOSURE A heat resistant resin composition comprises 100 wt. parts of a mixture (I) and 0 to 10 wt. parts of a phenoxy resin [II] wherein the mixture [I] comprises 80 to 5 wt. parts of (a) a mixture of 0 to 95 wt. parts of the first maleimide compound obtained by reacting an aromatic amine with maleic anhydride and/ or a maleic anhydride derivative and 100 to 5 wt. parts of the second maleimide obtained by reacting an aromatic amine with a cyclic acid anhydride not having an unsaturated double bond and maleic anhydride and/or a maleic anhydride derivative and 20 to 95 wt. parts of (b) an epoxy resin.

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