Heat-resistant resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3029, 400/41

C08L 51/04 (2006.01) C08G 59/14 (2006.01) C08G 59/30 (2006.01) C08K 3/22 (2006.01) C08K 5/54 (2006.01) C08L 25/08 (2006.01) C08L 63/00 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1327414

ABSTRACT OF THE DISCLOSURE A resin composition comprising (A) at least one heat-resistant resin, (B) at least one thermoplastic resin, (C) an antimony oxide, (D) at least one bromine- containing reaction product selected from the group consisting of (1) a compound having a molecular weight of from 1,200 to 6,000 and a bromine content of from 5.0 to 60% by weight which is obtained by reacting a bromine-containing epoxy compound and 1,3,5- tribromophenol, and (2) a compound obtained by reacting a bromine-containing epoxy compound having an epoxy equivalent of from 450 to 7,000 and a bromine content of from 5.0 to 52% by weight and an acrylonitrile-butadiene copolymer having a carboxyl group at the both terminals thereof and a molecular weight of from 1,000 to 10,000, and (E) at least one silicon-containing compound selected from the group consisting of (1) silicone oil, (2) a ladder silicone resin, and (3) an alkoxysilane having a mercapto group, a vinyl group or a methacryloyl group, is disclosed. The resin composition is excellent in heat resistance, impact resistance, flame retardancy, and molding properties.

603622

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