C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/196, 400/581
C08L 79/04 (2006.01) C08G 59/40 (2006.01) C08J 5/24 (2006.01) C08L 35/00 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) H05K 1/03 (2006.01)
Patent
CA 1056541
ABSTRACT OF THE DISCLOSURE A heat-resistant composition suitable for use in multilayer super high density printed circuit boards, comprising a polyaminobismaleimide, a polyepoxy compound, and an aromatic vinyl copolymer containing as structural unit maleic anhydride and/or an alkyl maleate. This resin composition is excellent in thermal resistance and dimensional stability, which are important properties or a resin composition for practical use in lamination, and when used in lamination, exhibits favorable flow and curing properties so that it can be easily and economically processed under conventional laminating conditions. When used as a multilayer printed circuit board material, it is also characterized by excellent adhesion to a coper foil, particularly in bonding an inner circuit copper foil to the board. Although particularly suitable for use in multilayer printed circuit boards of numerous layers (eight or more layers) bearing highly packed circuits and as an interlayer adhesive sheet, the present resin composition can be used in general heat-resistant printed circuit boards and in general heat-resistant structural laminates.
225895
Watanabe Tsutomu
Yamaoka Sigenori
Na
Sumitomo Bakelite Company
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