Heat resistant resin compositions, articles and method

Details Heat resistant resin compositions, articles and method Heat resistant resin compositions, articles and method

H - Electricity

01

B

H01B 3/40 (2006.01) C08F 267/10 (2006.01) C08F 283/10 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) H01B 3/30 (2006.01) H01B 7/29 (2006.01) H02K 3/30 (2006.01)

Patent

CA 2057537

Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200-250° C temperature range.

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