C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/08 (2006.01) B32B 27/06 (2006.01) B32B 27/08 (2006.01) C08J 5/18 (2006.01) C08L 23/10 (2006.01)
Patent
CA 2103790
2103790 9214784 PCTABS00015 Heat sealable compositions suitable for film and film structures comprise: (a) from 30 to 70 weight percent of a low melting polymer comprising an ethylene based copolymer having a density of from 0.88 g/cm3 to 0.915 g/cm3, a melt index of from 1.5 dg/min to 7.5 dg/min, a molecular weight distribution no greater than 3.5, and a composition distribution breath index greater than 70 percent; and, (b), being different from (a), from 70 to 30 weight percent of a propylene based polymer having from 88 mole percent to 100 mole percent propylene and from 12 mole percent to 0 mole percent of an alpha-olefin other than propylene.
Chen Michael Chia-Chao
Mehta Aspy Keki
Borden Ladner Gervais Llp
Exxon Chemical Patents Inc.
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