Heat-sealable multi-layer polyolefin structure including...

Details Heat-sealable multi-layer polyolefin structure including... Heat-sealable multi-layer polyolefin structure including...

B - Operations, Transporting

29

C

18/783

B29C 47/02 (2006.01) B32B 27/00 (2006.01) B32B 27/32 (2006.01)

Patent

CA 1288569

Abstract of the Disclosure HEAT SEALABLE MULTI-LAYER POLYOLEFIN STRUCTURE INCLUDING FATTY ACID AMIDE Multi-layer structures, such as films of low coefficient of friction also having anti-stick characteristics over a wide temperature range during heat-sealing are disclosed. In accordance with a preferred embodiment, the films comprise a polypropylene base layer of comparatively high steroregularity and two heat sealable skin layers of a low stereoregularity polyolefin and microcrystalline wax disposed on opposite sides of the base layer. Methods for forming such structures are also disclosed. Included in the film structure is an amount of fatty acid amide which is sufficient to provide the structure with coefficient of friction properties sufficient for high speed heat sealing packaging operations but insufficient to cause substantial hazing of the structure.

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