Uncategorized
Patent
Uncategorized
154/100
Patent
CA 940034
LandOfFree
Heat-sealing of paper substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-sealing of paper substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sealing of paper substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-297116