G - Physics – 01 – K
Patent
G - Physics
01
K
73/72
G01K 7/18 (2006.01) G08B 17/06 (2006.01)
Patent
CA 2000611
ABSTRACT OF THE DISCLOSURE A sensor for directly and continuously measuring increases and decreases in temperature comprising a carrier having characteristics sufficient for thermal nondestructive cycling and a conductor in thermal consonance with said carrier whereby the thermal transfer associated with said conductor causes a change in resistance/conductivity from which a temperature profile is acquired without mechanical strain, physical stress or irregular changes in the performance of said conductor. Preferably, the carrier is thermoplastic and has a thickness of less than approximately 25 mils. Also preferably, the conductor is electronic and has a thickness of less than approximately 100,000 angstroms (.ANG.) In another embodiment a method is provided of directly and continuously measuring increases and decreases in temperature, which method comprises bonding an electronic conductor in thermal consonance with a thermoplastic carrier, applying an electric current to the electronic conductor whereby the thermal transfer associated with the electronic conductor causes a change in resistance/conductivity without mechanical strain, physical stress or irregular changes in the performance of the electronic conductor, and measuring the change in resistance/conductivity from which a temperature profile is acquired.
Beatty Joseph R.
Kiec Thomas M.
Beatty Joseph R.
Kiec Thomas M.
Riches Mckenzie & Herbert Llp
LandOfFree
Heat sensing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sensing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sensing apparatus and method will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1368480