Heat-sensitive record material and microcapsule

Details Heat-sensitive record material and microcapsule Heat-sensitive record material and microcapsule

B - Operations, Transporting

01

J

42/3, 117/46.5

B01J 13/02 (2006.01) B41M 5/28 (2006.01) B41M 5/30 (2006.01)

Patent

CA 1339248

The invention describes a heat-sensitive record system employing capsules formed of excess polyisocyanate compared to the stoichiometric quantity needed for encapsulation. The microcapsules comprise an integral outer wall material and an open-pore sponge-like networked core extending from the wall material into the microcapsule and defined by a plurality of substantially discrete but extensively interconnected void spaces, a core material filling said void spaces, said microcapsule being a reaction product of an excess, compared to a stoichiometric amount for effecting encapsulation, of a polyisocyanate having a functionality greater than two with an active hydrogen-containing compound, said microcapsule being of less than 500 microns diameter and having a void volume of from 60% to 80% by volume.

611538

Affiliated with

Also associated with

Rating

Heat-sensitive record material and microcapsule does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sensitive record material and microcapsule, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sensitive record material and microcapsule will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1247529