H - Electricity
01
L
356/113
H01L 23/34 (2006.01) H01L 23/40 (2006.01) H01L 23/433 (2006.01) H05K 1/02 (2006.01)
Patent
CA 1266332
ABSTRACT OF THE DISCLOSURE Low thermal resistance coupling is provided between electronic components and a main heat sink by the expedient of providing individual, adjustable height pillars between them. Each pillar comprises a bifurcated body and a detachable head. The head is attached to the hot component by means of silver loaded epoxy. The height of the pillar may subsequently be adjusted, the component attached to a circuit board, and the pillar secured by establishing an interference fit between the pillar and the walls of its mounting hole. Thermal resistances of less than 6.5°C/Watt are achieved between a semiconductor junction and a heat sink coupled in this way.
528096
Bullivant Dered
Dawes Ronald G.
Hilton Geoffrey T.
Marshall Anthony W.
British Telecommunications Public Limited Company
Bullivant Dered
Dawes Ronald G.
G. Ronald Bell & Associates
Hilton Geoffrey T.
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