Heat sink

Details Heat sink Heat sink

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/36 (2006.01) H01L 23/367 (2006.01) H01L 23/467 (2006.01) H01L 35/30 (2006.01) H01L 23/38 (2006.01)

Patent

CA 2476251

A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.

Affiliated with

Also associated with

Rating

Heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1910183