H - Electricity
01
L
H01L 23/46 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2533536
A heat sink includes: a first end; a second end; an exterior surface; a plurality of fins including a first fin and a second fin adjacent the first fin, each of the first fin and the second fin being substantially annular in form with an opening formed therethrough; a fin space between the first fin and the second fin to permit the flow of heat transfer fluid therethrough; a duct extending through the plurality of fins into which the fin space opens, the duct formed at least in part by corresponding arrangement of the openings of the first fin and the second fin, the duct opening at the first end of the heat sink to the exterior surface; and a thermal plate in heat conducting communication with the first fin and the second fin.
Bennett Jones Llp
Coolit Systems Inc.
LandOfFree
Heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2047244