Heat sink device for electronic devices

Details Heat sink device for electronic devices Heat sink device for electronic devices

H - Electricity

05

K

H05K 7/20 (2006.01) G06F 1/20 (2006.01)

Patent

CA 2276795

A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof.

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