Heat sink devices for use in electronic devices

Details Heat sink devices for use in electronic devices Heat sink devices for use in electronic devices

H - Electricity

05

K

H05K 7/20 (2006.01) G06F 1/20 (2006.01) H01L 23/36 (2006.01) H01L 23/467 (2006.01)

Patent

CA 2322933

A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board. of the CPU assembly or the heat sink can be made as small as possible to ensure a great advantage in design. Fastening members, connecting pins or like fasteners used are unlikely to project beyond the outer surface of the CPU assembly to ensure compactness. Furthermore, the heat sink device achieves a high radiation efficiency and is less costly to manufacture.

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