H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/36 (2006.01) H01L 23/40 (2006.01)
Patent
CA 2315660
A heatsink is provided for a integrated electronic chip on a carrier. The chip may be surface mountable or a direct attach chip. The heatsink may be placed onto a carrier using SMT device placement machines. The heatsink is placed in a heat transfer path associated with a chip on the carrier. The heatsink has a footing for mounting to the carrier and a post extending upwardly from the carrier when the footing is mounted to the carrier. The post has a distal portion having a height to stand proud of the wire bonds when the footing is mounted to said carrier. When the chip is encased in an encapsulant, the distal portion of said post stands proud from the encapsulant allowing transfer of thermal energy from the chip encased in the encapsulant to the heatsink, to the post, to the atmosphere.
Davis John G.
Shumin William A.
Blake Cassels & Graydon Llp
Celestica International Inc.
LandOfFree
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