Heat sink for power electronic devices

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) H01L 23/367 (2006.01)

Patent

CA 2356791

A heat sink is provided having a base member and a plurality of heat dissipating elements that are spaced apart, attached to and project from the base member. The outer two heat dissipating elements are arranged to define a generally U- shaped structure enclosing the remaining of the heat dissipating elements located intermediate the outer two heat dissipating elements.

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