Heat sink for semiconductor components or similar devices,...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 23/36 (2006.01) B21K 25/00 (2006.01) B23P 11/02 (2006.01) B23P 15/26 (2006.01) B23P 19/02 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2457042

The invention relates to a heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. Said heat sink comprises cooling ribs (20) which rise at a distance from a base plate (12) and which are clamped in an insert groove made in the surface of the base plate (12), laterally limited by longitudinal or intermediate ribs with a coupling base (24) that has an approximately rectangular cross-section. The coupling bases (24) are held in their insert grooves in a form-fit and are cold-welded with the base plate (12) at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base (24) in a form-fit.

L'invention concerne un corps de refroidissement pour composants semi-conducteurs ou dispositifs analogues en particulier, en alliage d'aluminium extrudé présentant des ailettes de refroidissement (20) émergeant d'une plaque de base (12), agencées à intervalles entre elles, chacune ayant un socle de couplage (24) de section sensiblement carrée, lesquelles sont maintenues serrées dans une rainure rapportée dans la surface de ladite plaque de base (12), délimitées latéralement par les ailettes longitudinales ou intermédiaires. L'invention est caractérisée en ce que les socles de couplage (24) sont maintenus par liaison de forme dans leurs rainures et sont soudés à froid, au moins par endroits, avec ladite plaque de base (12). Sur les surfaces des ailettes intermédiaires s'étendent des ailettes transversales à distance entre elles, sous forme de bourrelets refoulés, raccordés par liaison de forme aux socles de couplage (24).

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink for semiconductor components or similar devices,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink for semiconductor components or similar devices,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink for semiconductor components or similar devices,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1560100

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.