H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/3
H05K 1/02 (2006.01) H01L 23/40 (2006.01) H05K 7/20 (2006.01)
Patent
CA 1246750
HEAT SINK FOR SOLID STATE DEVICES CONNECTED TO A CIRCUIT BOARD Abstract of the Disclosure The present invention removably mounts a plurality of solid state devices and a circuit board to a chassis heat sink by utilizing a heat conductive device formed with a base and a leg portion with the leg portion extending from the base and having a first relatively flat surface and an angled end portion. The base of the device is adapted to be mounted to a chassis heat sink and the relatively flat surface is adapted to contact one side of each of the plurality of solid state devices. A number of cap members having an inverted L-shaped cross section, with first leg portions and second leg portions are provided with an angled surface for mating with the angled end portion such that the first leg portions are substan- tially parallel to the first relatively flat surface. Means are provided for urging the first leg portions of the cap member toward the first relatively flat surface for sandwiching the plurality of solid state devices in thermal contact with the heat conductive device and the number of cap members.
528948
Ncr Corporation
Smart & Biggar
LandOfFree
Heat sink for solid state devices connected to a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink for solid state devices connected to a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink for solid state devices connected to a circuit board will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1229755