H - Electricity – 05 – K
Patent
H - Electricity
05
K
85/112, 356/21
H05K 7/20 (2006.01)
Patent
CA 1162324
HEAT SINK MOUNTING ABSTRACT OF THE DISCLOSURE Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.
404263
Hundt Roger C.
Jordan William D.
Pritchett James D.
Johnson Ernest Peter
Thermalloy Incorporated
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