Heat sink mounting

H - Electricity – 05 – K

Patent

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Details

85/112, 356/21

H05K 7/20 (2006.01)

Patent

CA 1162324

HEAT SINK MOUNTING ABSTRACT OF THE DISCLOSURE Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

404263

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