H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/113
H01L 23/34 (2006.01) H01L 21/50 (2006.01) H01L 23/049 (2006.01) H01L 23/10 (2006.01)
Patent
CA 1224575
Abstract of the Disclosure A heat sink mounting for a semi-conductor device includes a base member having a base body defining a generally cylindrical recess and a downwardly extending stem portion. The base body further defines an annular groove extending around the side surface of the cylindrical recess. A cap member detachably engages the base member and encloses the cylindrical recess. The cap member includes a tab arrangement which extends radially outward from the bottom of the cylindrical side wall of the cap member to engage the annular groove.
493523
Gowling Lafleur Henderson Llp
Nippert Company (the)
LandOfFree
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