Heat sink mounting system for semiconductor devices

Details Heat sink mounting system for semiconductor devices Heat sink mounting system for semiconductor devices

H - Electricity

01

L

H01L 23/40 (2006.01)

Patent

CA 2097097

A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (8) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (8) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).

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