Heat sink with visible logo

H - Electricity – 01 – L

Patent

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Details

H01L 23/36 (2006.01) G09F 3/02 (2006.01) H01L 23/367 (2006.01)

Patent

CA 2458080

A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

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