H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/36 (2006.01) G06F 1/20 (2006.01) H01L 23/40 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2310358
A heat sink for CPUs for use in personal computers comprises a radiating base plate of metal having on one surface thereof a flat portion for receiving the heat generated by the CPU, and a plurality of radiating fins formed in a raised shape on the other surface of the radiating base plate integrally therewith by cutting. The heat sink is 3 to 8 mm in the thickness of the radiating base plate, 20 to 50 mm in the height of the radiating fins from the base ends of the fins to the outer ends thereof, 0.2 to 0.7 mm in the thickness of the radiating fins, 1.5 to 4 mm in the fin pitch of the radiating fins, and 6 to 62 in the ratio of the height of the radiating fins from the base ends to the outer ends to the spacing between the radiating fins adjacent to one another. When equipped with a cooling fan, the heat sink is 3 to 8 mm in the thickness of the radiating base plate, 15 to 35 mm in the height of the radiating fins from the base ends of the fins to the outer ends thereof, 0.2 to 0.7 mm in the thickness of the radiating fins, 1.5 to 2.5 mm in the fin pitch of the radiating fins, and 7 to 44 in the above-mentioned ratio. The heat sink can be provided with a greater number of radiating fins than the conventional heat sink wherein 94 platelike radiating fins are formed integrally with a radiating base plate when both the sinks are identical in the size of the base plate, hence an increased radiating area.
Akutsu Shoji
Hashimoto Suzushi
Kinaga Kazuo
Fetherstonhaugh & Co.
Showa Aluminum Corporation
Showa Denko K.k.
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