Heat sinks with distributed and integrated jet cooling

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01)

Patent

CA 2697870

A heat sink (10) with distributed jet cooling is provided. The heat sink includes a base (12) for thermal connection to at least one heated object (20), an array of fins (14) thermally coupled to the base, and at least one multi-orifice synthetic jet (30) or multiple single orifice jets disposed on a side (15, 16) of the array of fins. A heat sink (100) with distributed and integrated jet cooling is also provided and includes a base (12) and an array of fins (114). Respective ones of at least a subset of the fins comprise a synthetic jet (102) configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink (200) with distributed and integrated jet cooling is provided and includes a base (12), an array of fins (214) and multiple synthetic jets (202) coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

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