Heat spreader mounting pad configurations for laser soldering

Details Heat spreader mounting pad configurations for laser soldering Heat spreader mounting pad configurations for laser soldering

H - Electricity

05

K

H05K 1/18 (2006.01) H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 7/20 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2268700

There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.

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