Heat stable, polymer-forming composition

Details Heat stable, polymer-forming composition Heat stable, polymer-forming composition

C - Chemistry, Metallurgy

08

K

117/42, 400/5001

C08K 5/36 (2006.01) C08L 57/00 (2006.01) C08L 67/06 (2006.01) C09D 4/00 (2006.01) G01N 1/36 (2006.01)

Patent

CA 1198539

Abstract of the Disclosure A heat-stable, liquid, polymer-forming adhesive composition comprising: (a) a polymerizable material selec- ted from a vinyl monomer containing at least one reactive double bond, an unsaturated polymer containing ethylenic carbon-carbon double bonds or a mixture thereof; (b) a transition metal compound; (c) a polymer chain terminating antioxidant; and (d) a preventive antioxidant for decom- posing hydroperoxides; wherein the resulting composition is a stable, storable, pourable liquid, which is curable to a solid polymer on initiation of a curing step is dis- closed as well as particular uses of such composition.

361662

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