Heat stable polymeric gelloids

Details Heat stable polymeric gelloids Heat stable polymeric gelloids

H - Electricity

01

B

117/170, 400/180

H01B 1/20 (2006.01) C08L 23/22 (2006.01) C09K 3/10 (2006.01) H01B 1/12 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01) H01B 3/18 (2006.01) H01B 3/40 (2006.01) H01B 3/44 (2006.01) H02G 15/00 (2006.01)

Patent

CA 1295766

ABSTRACT The invention relates to novel gelloid compositions, methods of making the compositions, methods of covering a substrate and providing an insulation conductive of stress grading layer of a gelloid composition, and use of the gelloid compositions with an electrical device, the gelloid compositions comprising a crosslinked non-silicone polymer having an olefinic unsaturated content of less than 10 mole percent and having from about .1 to about 3 crosslinks per weight average molecule, having dispersed therein a liquid in an amount of from about 20% to about 95% by weight based on the weight of the liquid and polymer, and from 0 to 0.3 volume fraction of a filler, said composition having a storage modulus of (1+2.5v+14.1v2)x dynes/cm2 wherein x is less than 5x105 at 30°C and greater than 5x103 at 90°C, and v is the volume fraction of the filler and, a dynamic visco- sity of (1+2.5v+14.1v2)y poises wherein y is less than 1x105 at 30°C and greater than 3x103 at 90°C and v is the volume fraction of the filler, and exhibiting first degree blocking. These novel compositions have good heat stabi- lity, low water and oil permeability, good adhesion and pro- perties useful for electrical insulation, conductive and stress grading applications.

489732

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