Heat transfer boiling surface

Details Heat transfer boiling surface Heat transfer boiling surface

F - Mech Eng,Light,Heat,Weapons

28

F

257/27

F28F 1/36 (2006.01) F28F 1/12 (2006.01) F28F 13/18 (2006.01)

Patent

CA 1155107

HEAT TRANSFER BOILING SURFACE ABSTRACT OF THE DISCLOSURE: A heat transfer device comprises a base wall of heat conductive material, a plurality of spaced apart fins formed integrally with the surface of the base wall at 30 to 40 fins per inch, and a plurality of indentations formed in the peripheral edge of the fins by a diamond knurling tool forming two series of parallel threads in the range of 40-80 threads per inch intersecting each other at an angle of 10 to 80 degrees.

392151

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