Heat transfer member

Details Heat transfer member Heat transfer member

H - Electricity

05

K

26/112, 347/5

H05K 7/20 (2006.01) F28F 3/02 (2006.01) H01L 23/367 (2006.01) H01L 23/44 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2023439

Abstract: A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers or the heat transfer unit permit liquid to to pass through the heat transfer unit and so conduct heat away. A semiconductor element (IC chip) is mounted on the mounting sheet and to a base. The resulting assembly is immersed in a liquid. The planes of the mesh layers are preferably generally perpendicular to the mounting sheet and to the semiconductor element, and the material of the mounting sheet is chosen to have a thermal expansion coefficient between that of the semiconductor element and that of the heat transfer unit to reduce thermal stresses. The wires of the mesh layers are preferably of copper, as this is inexpensive and provides satisfactory heat conduction.

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