Heat transfer structure

F - Mech Eng,Light,Heat,Weapons – 28 – D

Patent

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122/143, 257/15

F28D 7/00 (2006.01) F22B 27/14 (2006.01) F24H 1/14 (2006.01) F24H 1/16 (2006.01) F28F 13/00 (2006.01) H01J 19/36 (2006.01) H01L 25/03 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1040025

Abstract of the Disclosure Disclosed is a heat exchange structure for transferring heat between first and second fluid media through a thermally conductive rigid structure which incorporates a passageway for the first medium and a plurality of flow paths for the second medium. The paths are defined between a plurality of layers of bodies which are bonded together and to the portions of the structure forming the passageway in regions of contact therewith forming a matrix and whose surfaces, which form the elemental surface areas of the flow paths, are predominantly convexly curved in all directions. The average length of the flow paths is not greater than 15 times the average radius of curvature of the elemental surface areas.

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