Heat transfer surface for electronic cooling

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01)

Patent

CA 2605966

A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels. When the temperature of the electronic component rises, the heat is transferred to the refrigerant in the cooling surface, at least some of which vaporizes to carry heat away from, and facilitate cooling of, the component.

L'invention concerne une surface de refroidissement destinée à refroidir un composant électronique. Ladite surface possède deux ensembles d'ailettes, chacun définissant un ensemble de canaux, et un certain nombre de passages reliant les ensembles de canaux. La surface de refroidissement peut être fixée à un composant électronique, par exemple une puce, et un réfrigérant alimente au moins un ensemble de canaux. Lorsque la température du composant électronique augmente, la chaleur est transférée au réfrigérant dans la surface de refroidissement, dont une partie au moins s'évapore éloignant la chaleur dudit composant, ce qui facilite son refroidissement.

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