Heat-transferable security stamp

Details Heat-transferable security stamp Heat-transferable security stamp

G - Physics

09

F

G09F 3/03 (2006.01) B41M 3/12 (2006.01) B41M 3/14 (2006.01) G09F 3/10 (2006.01)

Patent

CA 2316024

A heat-transferable security stamp is provided including a carrier sheet, a top coat layer, at least one design layer between the carrier sheet and the top coat layer, a release layer between the carrier sheet and the design layer, and a base coat layer between the release layer and the design layer. The release layer includes a water-borne release component. The base coat layer includes a water-borne base coat component. The design layer includes a water-borne design component. The top coat layer includes a water-borne top coat component. The carrier sheet is resistant to heat above a predetermined heat, transfer temperature. The adhesive release component of the release layer is operative to secure the carrier sheet to the base coat layer at temperatures below the heat transfer temperature and to permit release of the carrier sheet from the base coat layer at temperatures above the heat transfer temperature. The base coat component of the base coat layer is operative to function as a barrier between the release layer and the design layer at temperatures above and below the heat transfer temperature. The design component of the design layer is operative to provide an indication of the presence of the security stamp. The top coat component is operative to adhere to a substrate upon contact with the substrate and upon application of heat above the heat transfer temperature. The recited water borne components may be capable of being borne in water as an aqueous emulsion, an aqueous dispersion, or an aqueous solution.

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