B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 26/00 (2006.01)
Patent
CA 2579283
The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser (22), a substrate (24), and a tool (26). The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the substrate. The tool is disposed in removable contact with the substrate to conduct the heat energy away from the substrate to limit the altering of the substrate. Preferably, the tool has a thermal conductivity greater than that of the substrate and is more preferably a copper material, a gold material, a silver material, or an aluminum material.
Cette invention concerne un ensemble de traitement thermique. L'ensemble de traitement thermique se compose d'un laser (22), d'un substrat (24), et d'un instrument (26). Le laser émet une énergie laser en direction du substrat et de l'instrument. Le substrat absorbe l'énergie laser et produit une énergie thermique à l'intérieur du substrat qui le transforme. L'instrument est disposé en contact amovible avec le substrat pour repousser l'énergie thermique du substrat afin d'en limiter la transformation. L'instrument présente de préférence, une conductivité thermique plus forte que celle du substrat, et est de préférence, un matériau en cuivre, en or, en argent ou en aluminium.
Bagnall Christopher
Lineton Warran Boyd
Federal-Mogul Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Heat treating assembly and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat treating assembly and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat treating assembly and method will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2051870