Heater member for mounting heating object and substrate...

Details Heater member for mounting heating object and substrate... Heater member for mounting heating object and substrate...

H - Electricity

01

L

H01L 21/68 (2006.01) H01L 21/00 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2381115

In the heater member for mounting an object of heating, at least a part of a surface other than a surface mounting a substrate such as a semiconductor wafer or a substrate for liquid crystal, is mirror-finished. Accordingly, power fed to the heater for heating to a prescribed temperature can be reduced, and thus, a heater member for mounting an object of heating and a substrate processing apparatus using the heater member, that can heat the object with higher efficiency, can be obtained.

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