C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
25/128
C04B 35/58 (2006.01) C04B 35/581 (2006.01) F27D 7/06 (2006.01)
Patent
CA 1266554
HIGH THERMAL CONDUCTIVITY CERAMIC BODY ABSTRACT OF THE DISCLOSURE A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon LTlDM but not including lines LM and DM of Eigure 4, a porosity of less than about 10% by volume, and a thermal conductivity higher than 1.00 W/cm?K at 25°C which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges from point T1 up to point M of Figure 4, said compact having an equivalent % composition of Y, Al, O and N outside the composition defined and encompassed by polygon LTlDM of Figure 4, heating said compact to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon LTlDM but not including lines LM and DM of Figure 4, and sintering said deoxidized compact at a temperature of at least about 1855°C producing said ceramic body.
496579
Bobik Carl Francis
Huseby Irvin Charles
Company General Electric
Eckersley Raymond A.
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