B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 33/38 (2006.01) B29C 33/04 (2006.01)
Patent
CA 2271099
Method of making a mold half part and the mold part apparatus as so made, wherein a molding surface structure is formed having a first molding surface and a second surface remote from the first surface and defining therebetween a generally constant cross-sectional thickness. A heatpipe chamber is operably coupled to the mold surface structure for phase change heat transfer to or from the first surface via the structure and second surface. The heatpipe chamber means encompasses substantially all of the area of the first molding surface projected in a direction perpendicular to the parting line of the half mold part and in a preferred embodiment is in the form of cup-like or box- like shell having side walls joined to a bottom wall and having an open top closed by the molding surface structure so as to define a single chamber at least generally co- extensive and subjacent to the molding structure first surface. This chamber is sealed, evacuated and lined with wick material and charged with a suitable fluid to thereby be operable as a heatpipe. Cooling coils or heating elements are arranged in heat transfer relation with the shell walls. A plurality of support pillars in the heatpipe chamber support the first surface against deformation when the same is subjected to molding pressures in the operation of the mold part in a mold cycle. The pillars can be hollow sintered inert metal columns filled or lined with a supplementary wicking material or hollow metal perforated tubes. The perforated support tubes also act as a dispersing nozzle or nozzles for the incoming liquid phase charge fluid entering the chamber from a supplemental charge fluid pumping system, or they may act as charge fluid liquid phase evacuation outlets from the heatpipe chamber to the supplementary pumping system. In an alternate embodiment a side- by- side nest of a plurality of pre-made heatpipe elements form an array having lateral dimensions at least generally co-extensive with the lateral dimensions of the first surface of the half mold part when finished. The array of heatpipe elements are encapsulated with a mold-forming material having the mold-cavity-defining first surface.
Marks & Clerk
Ouellette Joseph P.
LandOfFree
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