Heatsink and method of fabricating same

Details Heatsink and method of fabricating same Heatsink and method of fabricating same

F - Mech Eng,Light,Heat,Weapons

28

D

F28D 19/00 (2006.01) H01L 23/36 (2006.01) H01L 23/46 (2006.01)

Patent

CA 2704870

A heatsink assembly (10) for cooling a heated device (50) includes a ceramic substrate (64) having a plurality of cooling fluid channels (26) integrated therein. The ceramic substrate (64) includes a topside surface (56) and a bottomside surface (68). A layer of electrically conducting material (62) is bonded or brazed to only one of the topside and bottomside surfaces (66), (68) of the ceramic substrate (64). The electrically conducting material (62) and the ceramic substrate (64) have substantially identical coefficients of thermal expansion.

Affiliated with

Also associated with

Rating

Heatsink and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heatsink and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink and method of fabricating same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1544226