Heavy-current flowing circuit substrate, a method for...

H - Electricity – 01 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01B 5/00 (2006.01) H01R 9/22 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 3/20 (2006.01) H05K 7/00 (2006.01) H05K 1/00 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2240511

A heavy-current flowing circuit substrate 1 comprises a resin-molded body 2 in which a plurality of bus bars 4 made of an elongated metallic plate 3 are embedded and both ends of each of the bus bars 4 are projected from the resin-molded body 2 so as to use them as connecting terminals, the heavy-current flowing circuit substrate 1 being attached or formed integrally with at least one printed circuit substrate 12 mounting thereon electronic devices 13.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Heavy-current flowing circuit substrate, a method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heavy-current flowing circuit substrate, a method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heavy-current flowing circuit substrate, a method for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-2038493

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.