Hermetic package for a high power semiconductor device

Details Hermetic package for a high power semiconductor device Hermetic package for a high power semiconductor device

H - Electricity

01

L

H01L 23/10 (2006.01) H01L 21/50 (2006.01) H01L 23/04 (2006.01) H01L 23/049 (2006.01) H01L 23/055 (2006.01) H01L 23/367 (2006.01) H01L 23/373 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2139452

A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is bonded to one surface of the device, and electrical contacts on the opposing surface of the device are bonded to foils that seal openings in the base for contact pins.

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