Hermetic package for integrated circuit chips

Details Hermetic package for integrated circuit chips Hermetic package for integrated circuit chips

H - Electricity

01

L

356/143

H01L 23/02 (2006.01) H01L 23/13 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1313427

HERMETIC PACKAGE FOR INTEGRATED CIRCUIT CHIPS ABSTRACT OF THE DISCLOSURE The hermetic package (10) has an interior recess (46) for receipt of a semiconductor chip. The recess is square and set at 45° with respect to the rectangular exterior of the package. The ceramic layers which make up the package carry conductive planes thereof with the interior opening stepped to provide connection points. The lowest layer having a chip opening therein may be left out of the assembly for providing a larger chip opening recess.

592731

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