Hermetic pin grid array package

Details Hermetic pin grid array package Hermetic pin grid array package

H - Electricity

05

K

356/143

H05K 1/18 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1301369

HERMETIC PIN GRID ARRAY PACKAGE ABSTRACT OF THE DISCLOSURE A pin grid array package includes an electrically insulating, moisture impervious base having a plurality of bores therethrough, electrically conducting pins extending through the bores, metallic collars wedged between the pins and the bores adjacent the bottom side of the base, an electrically conducting trace formed of a silver-2 percent platinum alloy extending from each pin to the location for attachment of an electrical device, and a melted eutectic bond between the metal of the conducting path and the head of the pin at the top side of the base.

585310

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