Hermetic power chip packages

Details Hermetic power chip packages Hermetic power chip packages

H - Electricity

01

L

356/87

H01L 23/02 (2006.01) H01L 23/049 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1216960

HERMETIC POWER CHIP PACKAGES Abstract of the Disclosure Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilize dielectric plates with metallic sheets bonded to the dielectric plates. Electric access to at least selected terminals of a power chip is gained through one of the dielectric plates by including holes through the plates which are filled with a conductive medium. One form of the hermetic package includes a gasket with a thermal expansion coefficient close to that of a dielectric plate of the hermetic package and thereby results in a high level of package durability even after repeated cycling of the package between widely differing hot and cold temperatures.

461633

Affiliated with

Also associated with

Rating

Hermetic power chip packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetic power chip packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetic power chip packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1169163