H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/21, 356/3, 3
H05K 1/00 (2006.01) H01L 23/047 (2006.01) H01L 25/16 (2006.01)
Patent
CA 1210874
ABSTRACT A sealed solid-state electronic hybrid package com- prises a base plate for mounting at least one electronic component in thermal contact along a first surface of the base plate. The base plate has a second surface adapted to be mounted in thermal contact with a surface of an external heat sink. The base plate is formed of a metal having high heat conductivity. A ring frame formed of amorphous poly- mer polyamide-imide material having approximately 30% glass fiber and 1% PTFE is moulded into contact with the base plate first surface about a first edge surface of the ring frame. The ring frame has at least one electrical lead moulded through a side thereof, and the lead projects into the interior volume of the ring frame for connection to the electronic component. A cover plate fabricated from amor- phous polymer polyamide-imide material having approximately 30% glass fiber and 1% PTFE overlies a second edge surface of the ring frame. The second ring frame edge surface and the congruent area of the cover plate are metallized, and the metallized ring frame edge and metallized cover plate area are soldered together.
424106
Gray Ormal E.
Miller Wilson N.
National Aeronautics And Space Administration
Ridout & Maybee Llp
LandOfFree
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