H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01) H01L 23/538 (2006.01) H05K 5/00 (2006.01)
Patent
CA 2144088
A hermetic seal (50) is sealed to the top layer of the multilayer circuit board, and the circuit paths and/or vias are selective- ly connected to external pads (68) by vias (64, 66) extending through the multilayer circuit board, one via (66) terminating at a pad (70) internal to the sealed region and another via terminating at the external pad. In one form, the vias providing the external connection extend into a substrate (16) supporting the board, and circuit paths (72) in the substrate electrically connect the vias together. In second form, the vias providing the external connection are electrically connected together by selected circuit paths (80) in the circuit board. A conductive anchor (60) extends through the circuit board to the substrate to provide an anchor for the seal. Where the vias providing external connection are connected by selected circuit paths in the circuit board, the conductive an- chor comprises posts (82) having openings through which the selected circuit paths pass.
Bereskin & Parr
Ceridian Corporation
LandOfFree
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