Hermetically sealed container for semiconductor and other...

H - Electricity – 05 – K

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356/169

H05K 5/06 (2006.01) H01L 23/047 (2006.01) H01L 23/057 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1043019

HERMFTICALLY SEALED CONTAINER FOR SEMICONDUCTOR AND OTHER ELECTRONIC DEVICES ABSTRACT OF THE DISCLOSURE An hermetically sealed container for electronic devices comprises a supporting pad for an electronic device, a conductive lead frame surrounding the pad and forming therewith a unitary construction, and a sheet of homogeneous epoxy resin extending over and fused to each face of the frame, at least one of the sheets having an aperture dimensioned and disposed to surround the support- ing pad and a portion of the adjacent leads of the lead frame. The container further comprises upper and lower cover plates of a mater- ial of the group comprising metal, ceramic, glass, and rigid plastic fused to the plastic sheets, one of such plates having an opening in registry with the aperture in the adjacent one of the plastic sheets for receiving an electronic device to be supported on the pad. The container further comprises means for hermetically sealing the opening in such one of the cover plates, for example an upset cavity in the plate forming an integral portion thereof. In an alternative construction, the supporting pad for the electronic device is a portion of the lower cover plate in the form of an upwardly protruding pedestal and each of the plastic sheets has an aperture dimensioned and disposed to surround such supporting pad and a portion of the adjacent leads of the lead frame, the pedestal extending at least partially through the aper- ture of the adjacent one of the plastic sheets.

260197

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