Hermetically sealed electronic component

Details Hermetically sealed electronic component Hermetically sealed electronic component

H - Electricity

05

K

356/8

H05K 1/02 (2006.01) H01C 13/02 (2006.01) H01C 17/242 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H05K 3/00 (2006.01) H05K 1/03 (2006.01) H05K 1/16 (2006.01)

Patent

CA 1270340

ABSTRACT A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquefier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

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