Hermetically sealed package having an electronic component

Details Hermetically sealed package having an electronic component Hermetically sealed package having an electronic component

H - Electricity

01

L

26/112

H01L 21/48 (2006.01)

Patent

CA 1313298

METHOD OF MAKING A HERMETICALLY SEALED PACKAGE HAVING AN ELECTRONIC COMPONENT Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bonding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.

605591

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