H - Electricity – 01 – L
Patent
H - Electricity
01
L
26/112
H01L 21/48 (2006.01)
Patent
CA 1313298
METHOD OF MAKING A HERMETICALLY SEALED PACKAGE HAVING AN ELECTRONIC COMPONENT Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bonding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.
605591
Andrews Daniel M.
Borden Ladner Gervais Llp
Microelectronics And Computer Technology Corporation
LandOfFree
Hermetically sealed package having an electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hermetically sealed package having an electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed package having an electronic component will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1206856