Hermetically sealed semiconductor casing

Details Hermetically sealed semiconductor casing Hermetically sealed semiconductor casing

H - Electricity

01

L

356/168

H01L 23/06 (2006.01) H01L 23/047 (2006.01) H01L 23/10 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1244148

ABSTRACT The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.

491117

Affiliated with

Also associated with

Rating

Hermetically sealed semiconductor casing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed semiconductor casing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed semiconductor casing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1241454