Hermetically sealed semiconductor laser device

Details Hermetically sealed semiconductor laser device Hermetically sealed semiconductor laser device

H - Electricity

01

S

H01S 5/022 (2006.01) H01L 33/00 (2006.01) H01S 5/02 (2006.01) H01S 5/183 (2006.01)

Patent

CA 2375692

A wafer assembly that includes a wafer substrate. A plurality of micro- optomechanical or micro-optoelectrical devices are positioned on a surface of the wafer substrate. Each micro-optomechanical or micro-optoelectrical device has a seal surface. A plurality of seal caps are coupled to the micro- optomechanical or micro-optoelectrical devices. Each seal cap has a seal ring. The seal cap seal ring is coupled to a seal surface of the micro- optomechanical or micro-optoelectrical device to form a hermetic seal.

Cette invention se rapporte à une unité à plaquette de semi-conducteur qui comprend un substrat de plaquette. Plusieurs dispositifs micro-optomécaniques ou micro-optoélectriques sont placés sur une surface de ce substrat de plaquette. Chacun de ces dispositifs micro-optomécaniques ou micro-optoélectriques possède une surface d'étanchéité. Plusieurs couvercles d'étanchéité sont couplés aux dispositifs micro-optomécaniques ou micro-optoélectriques. Chaque couvercle d'étanchéité comporte une bague d'étanchéité. La bague d'étanchéité du couvercle d'étanchéité est couplée à une surface d'étanchéité du dispositif micro-optomécanique ou micro-optoélectrique, afin de former un joint d'étanchéité hermétique.

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